Tham txog Cov yam ntxwv ntawm Precision Parts Processing

Precision qhov chaw ua haujlwm muaj ntau qhov zoo, yav tas los qhia qhov zoo ntawm precision qhov chaw ua, nws yog qhov pom tseeb tias nws tuaj yeem ncav cuag qhov siab tshaj plaws uas kev ua haujlwm tsis tuaj yeem ncav cuag, siab precision kuj yog nyob ntawm precision ua cov cuab yeej thiab cov txheej txheem inhibition, thiab kev xaiv ntawm precision daim npog qhov ncauj raws li ib tug intermediary kom ua tau ib tug zoo heev tswj tus nqi ntawm deg txheej cov ntaub ntawv tshem tawm los yog nce, yog li dab tsi yog cov yam ntxwv ntawm precision qhov chaw ua?

1. Precision qhov txiav
Muaj feem ntau precision tig, daim iav sib tsoo thiab sib tsoo, thiab lwm yam. Micro-tig nrog precision-av ib qho siv lead ua pob zeb diamond tig cov cuab yeej ntawm lub tshuab dhos precision nrog txiav tuab ntawm tsuas yog li 1 micron feem ntau siv los ua cov txheej txheem siab, siab- brightness qhov chaw xws li spherical, aspherical, thiab tiaj tus iav ntawm cov ntaub ntawv uas tsis yog-ferrous hlau. Piv txwv li, daim iav aspheric nrog txoj kab uas hla ntawm 800 hli rau kev ua cov khoom siv hluav taws xob nuclear muaj qhov tseeb ntawm 0.1 microns thiab qhov roughness ntawm Rz 0.05 microns.

2. Precision qhov chaw ua
Thaum lub machining raug ntawm precision qhov chaw yog nanometer, los yog txawm thaum kawg nyob rau hauv atomic units (atomic lattice spacing yog {{0}}}.1 ~ 0.2 nanometers), lub ultra-precision qhov txiav txoj kev yuav tsis tau hloov, thiab nws yog ib qho tsim nyog yuav tsum tau cia siab rau cov txheej txheem ntawm kev ua haujlwm tshwj xeeb, uas yog, kev siv tshuaj lom neeg lub zog, hluav taws xob hluav taws xob, thermal zog lossis hluav taws xob hluav taws xob, thiab lwm yam. tshem tawm qhov txuas, kev sib koom ua ke lossis lattice deformation ntawm qee cov atoms ntawm qhov chaw ua haujlwm, thiaj li ua tiav lub hom phiaj ntawm ultra-precision machining. Muab faib raws li cov txheej txheem no yog cov txheej txheem mechanochemical polishing, ion sputtering thiab implantation, electron beam raug, laser beam processing, hlau evaporation, thiab molecular beam epitaxy.